Designing a Smarter and Greener Electric Grid:
A S D t D i A h
A Sensor-Data Driven Approach
Study of Power Consumption Monitoring Systems
Monitoring Systems
CDAC Thiruvananthapuram
CDAC Thiruvananthapuram
Organisation of the Presentation g
9About CDAC 9About CDAC
9 CDAC’s component in the project-Designing a Smarter and Greener Electric Grid: A Sensor-Data Driven
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Approach
9 Sensor configuration and digital processing platform required for home automation
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required for home automation
9 Scheme and description of the digital processing platform
9Configuration of the communication network 9Configuration of the communication network
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Centre for Development of Advanced Centre for Development of Advanced
Computing(CDAC)
Centre for Development of Advanced Computing (C‐
DAC) is the premier R&D organization of the
Department of Elecrinics and
Information Technology (DeitY), Ministry of Communications & Information Technology (MCIT)
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Communications & Information Technology (MCIT), Government of India for carrying out R&D in IT, Electronics and associated areas.
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¾ ¾ Multi‐locational, Multi‐activity R&D organization with HQ at Pune Multi locational Multi activity R&D organization with HQ at Pune
¾ Spread out at 10 locations with14 laboratories
¾ 2000 employees, involved in the design, development and deployment
¾ of electronics and advanced Information Technology
¾ Multi‐locational, Multi‐activity R&D organization with HQ at Pune
¾ Spread out at 10 locations with14 laboratories
¾ 2000 employees, involved in the design, development and deployment
¾ of electronics and advanced Information Technology
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CDAC Thiruvananthapuram
¾ of electronics and advanced Information Technology
C-DAC-Thiruvananthapuram
Scientific Society of the Department of Information Technology Scientific Society of the Department of Information Technology, Ministry of Communication & Information Technology(DeitY), Government of India
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Government of India Development Groups
¾ Broadcast & Communications Group (BCG)
¾ P El i G
www¾ Power Electronics Group
¾ Control and Instrumentation Group
¾ Strategic Electronics Group
¾ Hardware Design Group
¾ Hardware Design Group
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Activities in Power Electronics Group
M lti l l PQ
Simulation Real time Multi-level
Inverters
PQ solutions
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Distributed
Generation Current EV/HEV
Activities
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Energy storage
UPS Drives SMPS
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Scope of the Project p j
CDAC’s objective in this project is to provide sufficient inputs to the main project which will be piloted by IITB and UMASS
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UMASS.
As a development partner, CDAC proposes a study which
i l d id tifi ti f it bl t h l f
wwwinvolves survey and identification of suitable technology for monitoring the energy consumption at the point of electrical power outlets in walls of residential buildings.
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Study Points y
The study will cover
St d d f d t h h i H A
• Standards for data exchange schemes in Home Area Networks and Industrial environment and the hardware requirement for the same
St d d l t f f t d
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• Study on deployment of sensors for measurement and monitoring the power consumption pattern of various loads
• Design of an embedded platform which can be integrated
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with the wall mounted distribution board in in a smart home
• Deployment scheme for current and voltage sensors at different points in the network
• Algorithms to identify the type of load based on active/reactive/harmonic pattern
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Physical Outcome of the Project y j
CDAC ill d t d t il d d t d th
CDAC will conduct a detailed survey and study on the technology for power consumption measurement and various standards associated with such systems. After the
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studies, CDAC will generate a technical report containing
Hardware scheme with plan for sensor deployment
www Details on communication scheme
Requirement specification for the embedded hardware in the sensor unit
hardware in the sensor unit
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Hardware Architecture Hardware Architecture
The intelligence will be integrated with the distribution board as given in the block diagram. The hardware consists of the following building blocks
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• Voltage and current sensors
• Data acquisition hardware
D t i l tf
www• Data processing platform
• Intelligent switches for connection/disconnection of loads for demand response
for demand response
• Communication interface
• Data logging
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• Data logging
Architecture of Smart Distribution Board Architecture of Smart Distribution Board
LOAD 1
Intelligent Switch
Power outlet Smart Distribution Board
LOAD 2
LOAD 3
Utility Grid Current Sensor
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LOAD 4
LOAD 5
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LOAD N
A/D Conversion
Optional f/b
Voltage Sensor
Current Sensor for critical/selected loads
Processing, Monitoring and Control Platform
Communication Interface
HMI
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HMI
Architecture of the Processing Platform Architecture of the Processing Platform
Communication Interface Mass memory
Storage
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PROCESSING CORE
Switch/Relay Logic Memory
Interface
Relay Control Signals
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Switch/Relay Logic
A/D Converters DSP FPGA
Current f/b Voltage f/b
I/O Ports, HMI(Optional)
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Functions of the Processing Platform
Management and Control of Domestic Smart grid technology
• Sensing of voltage, current signals
• Estimation of active and reactive power
• Estimation of harmonic profile
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• Identification of loads and load changes
• Automatic controllability for the input switches
• Management of data communication
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• Identification of faults
• Algorithm for various demand side load management schemes
• Data storage – Time tagging – event recording etc..
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Detailed Scheme
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Features of the Processing Platform g
• Multi core processor (OMAP L137)
• FPGA for accelerating the speed of data processing (Cyclone II-EP2C5 from Altera)
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II EP2C5 from Altera)
• Ethernet, wireless, USB interfaces
• HMI for status indication and operator level controls
I/O t f ON/OFF t l
www• I/O ports for ON/OFF controls
• A/D channels for current and voltage feedback
• Optional feed back for various environmental parameters
• Data logging on local memory and SD card
• Time stamping of events with RTC
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Circuit Fabrication
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OMAP FPGA
Analog region Clock circuit
• PCB form factor : 220 x 150 mm
• No of Layers : 10 Layers
D i i i 16 bi 8 h l ADC(2 )
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• Data acquisition : 16 bit, 8 channel ADC(2 nos)
• Code and data storage : SPI flash, NAND flash
• Communication interfaces : UART, SPI, Ethernet,USB etc
Algorithms to be ported and tested on the g p Experimental platform platform
• Estimation of active and reactive power
(IEEE Standard 1459: Definitions for the Measurement of Electric Power Quantities Under Sinusoidal, Non sinusoidal, Balanced, or Unbalanced Conditions)
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• Estimation of harmonic current profiles
(Real time / off line – FFT)
• Identifying the type of loads based on power signature of
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individual loads
• Demand response based on operating conditions
(Electricity price, comfort level, Peak reduction etc..)
• Identification of faults on load side and protection
(Deviation from normal signature)
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Load signature
Reactive Power
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Active Power
THD
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Incandescent lamp – steady state Incandescent lamp steady state
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Voltage and current waveform Harmonic spectrum of current
Incandescent lamp – Transient Incandescent lamp Transient
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Voltage and current waveform Harmonic spectrum of current
CFL – Steady state y
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Voltage and current waveform Harmonic spectrum of current
CFL – Transient
C a s e t
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Voltage and current waveform Harmonic spectrum of current
Motor – Steady state oto Steady state
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Voltage and current waveform Harmonic spectrum of current
Communication Network
Exchanges Exchanges
9 Voltage & current (power), temperature, humidity and other physical parameters between nodes and controller
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9 Command signals to controllable equipments 9 System status
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Why ZigBee ?
• Reliable
• Reliable
• Supports large number of nodes
• Range suitable for home networks(~100m)
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• Easy to deploy
• Very long battery life
• Secure
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Secure
• Low cost
• Can be used globally
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Sample Scheme p
Current RF
Control
Measurement
Grid
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ZigBee Coordinator
& Data Collector
Control Unit
(Load Disaggregator &
D M )
Visuals
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CDAC Thiruvananthapuram
& Data Collector
Data Management)Intelligent Plug Power
Outlet
Current Measurement
Sensor / End Device CC2530
ADC Peripheral
2.4 GHz RF Transceiver 8051 MCU
Core
Sensor / End Device – CC2530 Relay
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Central Controller
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OMAP
PeripheralSPI 2.4 GHz RFTransceiver 8051 MCU
Core
Central Controller
Collector / Collector – CC2530
Peripheral Core Transceiver
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FPGA
Ethernet
Standards
IEEE Std 802.15.4e - 2012
IEEE Standard for Local and metropolitan area networks—
Part 15.4: Low-Rate Wireless Personal Area Networks (LR- WPANs)
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)
IEEE Std 1459 – 2010
IEEE Standard Definitions for the Measurement of Electric Power Quantities Under Sinusoidal Nonsinusoidal
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Power Quantities Under Sinusoidal, Nonsinusoidal, Balanced, or Unbalanced Conditions
IEC 614000-4-30 Edition 2.0 - 2008-10
Electromagnetic Compatibilty(EMC) part 4 30: Testing and Electromagnetic Compatibilty(EMC) part 4-30: Testing and measurement techniques - power quality measurement methods
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Network Topologies
• Mesh
• Star
• Star
• Ring
• Bus
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Bus
• Tree
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OSI Model
Application pp Presentation Application issues
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Session Transport
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Network Data transfer issues
Data link Physical
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ZigBee Protocol
Application & Profiles Application & Profiles
Application Framework
Network & Security layers ZigBee Specification
MAC layer
IEEE 802.15.4
PHY Layer
ZigBee Protocol
Application layer
controls the application(s) running on the ZigBee device, e.g current sensing
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Zigbee Stack layer
the protocols that look after routing the data to the correct destination and security
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destination and security
IEEE 802.15.4 standard
MAC sub-layer - responsible for addressing (where outgoing data is going to, and where incoming data has come from)
PHY b l ibl f th di t i i
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PHY sub-layer - responsible for the radio transmission
itself
Application Framework
AO / EP
240 AO / EP
ZigBee Device Object
(ZDO)
O Public erface
ZigBee
240 1
(ZDO)
APSDE‐
APSDE‐
SAP
APSDE‐
APSDE‐
SAP
ZDO Int
APSDE‐
APSDE‐
SAP
t
ZigBee Application
Application Support Sublayer (APS)
NLDE‐SAP NLME‐SAP
ty Ser vice anag emen t
AIB
Network Layer
NIBSecuri t ZDO M ZigBee Alliance
Media Access Control (MAC)
MLDE‐SAP MLME‐SAP
MIB
Physical Layer PD‐SAP
PIB
PLME‐SAP
IEEE 802.15.4
2.4 GHz 868 and 915 MHz
PIB
ZigBee Evaluation Module(EVM) &
IAR EW8051 IDE
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CC2530ZDK (From Texas Instruments)
CC2530ZDK includes:
• 2 SmartRF05 Evaluation Boards
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2 SmartRF05 Evaluation Boards
• 5 SmartRF05 Battery Boards
• 7 CC2530 Evaluation Modules
• 1 CC1531 USB Dongle
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• 1 CC1531 USB Dongle
• Antennas and batteries
• IAR EW8051 C-compiler with C-SPY debugger
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CC2530EM RF module
CC2531 USB Dongle
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g
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SmartRF05BB SmartRF05BB
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IAR EW 8051
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Thank You
Thank You
Variable Speed Wind Electric Generator
Machine side Inverter
Grid side Inverter
WEG GRID
Inverter Inverter
Digital Controller
40
Grid Interactive Solar PV Power Plant Grid Interactive Solar PV Power Plant
Solar Photovoltaic Array Utility Grid
Y
Power Electronic Interface Module
Transformer
Digital Controller
¾ MPPT Tracking
¾
¾ UPF Operation
¾ Current THD
¾ Anti‐islanding protection
protection
*
This was a joint project with IIT-Kanpur with field trial support from WBREDA, Kolkata 41BIM 1
Digital
BIO-MASS PLANT (20 kW)
BIM - Basic Interface Module (10 kVA)
Y BIM 2
BIM 3
Controller 1
WIND ELECTRIC
Y BIM 3 Y
BIM 4
CentralWIND ELECTRIC GENERATOR
(5 kW) Panel 1
Y
BIM 5
Central Control
unit Digital
Controller 2
SOLAR PANEL (55 kWp)
Y Y
BIM 7 BIM 6
Panel 2
Y BIM 7 Y
BIM 8
Digital
Controller 3 Dump
Y
LoadBIM 9 Y
Panel 3
42
Y
Synchronised Phasor Measurement Unit y
Local Display (HMI)
GPS Antenna
Synchrophasor
GPS Receiver ADC & Signal
Processor COM Processor
GPS Receiver g
Conditioning Circuits
Communication
Port
From CT & PTPhasor Messages
Flexible Open
43
p
SCADA
Prototype Developed by CDAC Prototype Developed by CDAC
PMU Module
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Sensor Module GPS Antenna
Power Quality Solutions Power Quality Solutions
3 Phase, 3 wire and 4 wire active filters
Si l h i fil
Single phase active filters Dynamic Voltage Restorer Shunt Hybrid Active Filters
Sour ce
Series Voltage Load injection
SERIES INVERTER
SHUNT CONVERTER
+ _
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