ELE6260 Low Power VLSI Design

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For old Curriculum/Syllabus visit:

https://www.amu.ac.in/newdata/udownloads/1

391.pdf

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Course Number and Title :

ELE6320 Bio-Instrumentation

Credits : 4 Course Category : PE Pre-requisite(s) : Contact Hours (L-G-P) : 3-1-0

Type of Course : Theory

Course Assessment : Home Assignments (15%) Midsem Examination (1 hour) (25%) Endsem Examination (2 hours) (60%) Course Outcomes

After completing this course the students should be able to:

1. Develop knowledge about human physiological system.

2. Understand various methods of acquiring bio signals.

3. Analyse and evaluate the principles of various biomedical devices and sensors.

4. Describe and design the instrumentation for amplifying the bioelectrical signals.

Syllabus

Physiology: Cell and Its Structure, Resting and Action Potentials, Propagation of Action Potentials

Nervous system: CNS, PNS, Nerve Cell, Synapse, Cardio Pulmonary System

Physiology of Heart and Lungs: Circulation and Respiration; Bioelectric Potentials: ECG, EEG, EMG, MEG, Bioelectric Signal Recording Machines; Electrophysiological Measurements: Biopotential Electrodes, Micro Needle and Surface Electrodes; Lead Systems and Recording Methods; Typical Waveforms

Bioelectric amplifiers: Interference in Bio Signals; Transducers for Biomedical Applications, Different Types, Selection Criteria; Acquisition of Bio-Signals

Medical Imaging: X-Ray, Computer Tomography, Magnetic Resonance Imaging

References:

1. R.S. Khandpur, Hand Book of Bio-Medical instrumentation, Tata McGraw Hill, Publishing Co Ltd., 2003.

2. Leslie Cromwell, Fred J Weibell, Erich A. Pfeiffer, Biomedical Instrumentation and Measurements, Prentice Hall of India 2^nd edition, 2005

3. John G Webster, Medical Instrumentation, John Wiley & Sons, 2005

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ELE6260 Low Power VLSI Design

1. Understand low power techniques at all levels of the design abstraction.

2. To estimate low power of a design.

3. To design low power architectures.

Syllabus

Introduction, Power and Energy Basics, Circuit level Dynamic Power Optimization Techniques, Architecture, Algorithm and System level Dynamic Power Optimizations, Interconnect and Clock Power Issues, Dynamic Memory Power Optimization, Leakage Power Optimization at Circuits and System Level, Leakage Power Optimization for Memory, Run time Circuit and System Power Optimization, Ultra Low Power Design, Low Power Design Methodologies and Flows

References:

1. J. Rabaey, Low Power Design Essentials, Springer, 2009

2. S.C. Prasad and Kaushik Roy, Low Power CMOS VLSI Circuit Design, Wiley, 2009 3. A. Chandrakasan and R. Brodersen, Low Power Digital CMOS Design, Springer, 1995.

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ELE6240 Memory Design

1. Design and optimize semiconductor memory cell for a given specification.

2. Design and optimize peripheral circuits such as Sense amplifier, address decoder, write drivers.

3. Design memory array of a given size and measure various performance metrics.

4. Design memory cells using emerging technologies such as STT-MRAM, ReRAM, PCRAM etc.

Syllabus

Random Access Memory Technologies: Static Random Access Memories (SRAMs): SRAM Cell Structures and Performance Metrics, SRAM Architecture, Peripheral Circuit Operation.

Advanced SRAM Architectures and Application Specific SRAMs.

Dynamic Random Access Memories (DRAMs): DRAM Technology Development-CMOS DRAMs, DRAMs Cell Theory and Advanced Cell Structures, Advanced DRAM Designs and Architecture-Application Specific DRAMs.

Nonvolatile Memories: Read-Only Memories, Programmable Road-Only Memories (EPROMs), Flash Memories, Advanced Flash Memory Architecture. Emerging Memories:

STT-MRAM, ReRAM, PCRAM etc References:

1. A.K Sharma, “Semiconductor Memories Technology, Testing and Reliability”, Illustrated Edition, IEEE Press, 1997.

2. Gerald Luecke, Jack P. Mize, William N. Carr, “Semiconductor Memory Design &

Application”, Illustrated Edition,Mc-Graw Hill, 1973.

3. Kiyoo Itoh, ‘VLSI memory Chip Design’, Springer, 2001.

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ELE6230 Mixed Signal Circuit Design

1. Learn the Design of switched capacitor circuits.

2. Learn the design of ADCs and DACs.

3. Design of mixed signal circuits from a given specifications.

Syllabus

Introduction to Data Conversion: Sampling Theory, Switches and Their Comparison, Sample and Hold Architectures, Comparators, Basics of Analog Discrete Time Filters, Switched Capacitor Circuits, DACs: R2R, Current Steering; SAR and Dual Slope ADCs, Flash and Pipelined ADCs, Sigma Delta ADCs, Sigma Delta DACs, Testing and Characterization of Data Convertors, Phase and Delay Locked Loops and Frequency Synthesizers, Mixed Signal Layout, Interconnects

References:

1. R. Jacob Baker, CMOS Mixed-Signal Circuit Design, Wiley India, IEEE press, reprint 2008.

2. R. Jacob Baker, CMOS Circuit Design, Layout and Simulation, Revised second edition, IEEE press, 2008

3. David Johns, Ken Martin, "Analog Integrated Circuit Design", John Wiley and Sons, 1997.

4. Behzad Razavi, "Design of Analog CMOS Integrated Circuits", McGraw Hill, 2000.

5. Behzad Razavi, "Principles of Data Conversion System Design", Wiley-IEEE Press, 1994.

6. Rudy van de Plassche, "Integrated Analog-to-Digital and Digital-to-Analog Converters", Springer, 2003.

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ELE6330 NEMS and MEMS

1. Describe MEMS and various figures of merit.

2. Identify the suitable materials for MEMS and design process steps for MEMS design.

3. Describe the sensor applications of MEMS and the working principle of various MEMS sensors.

Syllabus

Introduction to MEMS & Microsystems, Introduction to Microsensors, Evaluation of MEMS, Microsensors, Application of MEMS

MEMS Materials, MEMS Materials Properties, Microelectronic Technology for MEMS, Micromachining Technology for MEMS, Micromachining Process, Etch Stop Techniques and Microstructure, Surface and Quartz Micromachining, Fabrication of Micromachined Microstructure, Microstereolithography.

MEMS Microsensors (Thermal), Micromachined Microsensors (Mechanical), MEMS Pressure and Flow Sensor, Micromachined Flow Sensors, MEMS Inertial Sensors, Micromachined Microaccelerometers for MEMS, MEMS Accelerometers for Avionics, Temperature Drift and Damping Analysis, Piezoresistive Accelerometer Technology, MEMS Capacitive Accelerometer, MEMS Gyro Sensor, MEMS for Space Application, Wafer Bonding &

Packaging of MEMS, Interface Electronics for MEMS, MEMS for Biomedical Applications (Bio-MEMS), Introduction to Nano Electro Mechanical Systems.

References:

1. Hsu, Tai-Ran, MEMS & Microsystems Design and Manufacturing, McGraw-Hill, 2002.

2. M. J. Madou, Fundamentals of Microfabrication: The Science of Miniaturization, CRC Press, 2002.

3. Steven S. Saliterman, Fundamentals of BioMEMS and Medical Microdevices, SPIE Publications, 2006.

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ELE7000 Neural Networks and Machine Learning

1. Understand the basic concepts of Neural Networks and become aware of important ANN architectures.

2. Use machine learning for regression.

3. Use machine learning for classification and clustering.

4. Know about deep learning and its practical applications.

Syllabus

Artificial Neural Networks: Artificial Neuron; Activation Functions; Perceptron: Single-Layer and Multi-layer; Feedforward Networks; Gradient Descent and Stochastic Gradient Descent; Feedback (Recurrent) Neural Networks.

Regression: Introduction and Real-World Applications of Machine Learning; Regression: Simple, Multiple, Polynomial, Support Vector, Decision Trees, Random Forests, Regression with Neural Networks: Backpropagation learning.

Classification and Clustering: Logistic Regression, K-Nearest Neighbors Method, Support Vector Machines, Naïve Bayes Technique, Decision Tree Classification, Random Forest Classification;

Clustering: K-Means, Hierarchical; PCA and Feature Selection.

Deep Learning: Convolutional Neural Networks: Operation, ReLU Layer, Pooling, Flattening, SoftMax and Cross Entropy; Case Study on Image Classification.

References:

1. Simon Haykin, Neural Networks: A Comprehensive Foundation, Pearson Education Asia, 2^nd ed., 2001.

2. C. M. Bishop, Pattern Recognition and Machine Learning, Springer, 2006.

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ELE6160 Organic Electronics

1. Describe various organic electronic materials and their properties.

2. Describe the properties and operations of various organic electronic components.

3. Describe the applications of organic electronics.

Syllabus

Introduction to Organic Electronic Materials and Their Basic Properties; Charge Transport and Energy Band Structure of Organic Electronics; Case Studies on Specific Materials Used in Current Research; Optical Properties (Energy Levels, Color Changes, Light Emission and Absorption)

Organic Electronic Circuit Components (Conductors, Resistors, Capacitors, Diodes, Transistors); Electrochemistry of Organic Electronic Materials, and Applications of Redox Properties; Organic Bioelectronics

Printed Electronics (Methods, Inks, Applications); Organic Electronics Photovoltaics (Measurement Techniques, Solar Cells); An Overview of Current Applications and Commercialization, Organic Field Effect Transistors

References:

1. S.-S. Sun, L. R. Dalton, “Introduction to Organic Electronic and Optoelectronic Materials and Devices”, (Editor), CRC Press, 2008.

2. F. So, “Organic Electronics: Materials, Processing, Devices and Applications”, CRC Press, 2009.

3. I. Kymissis, “Organic Field Effect Transistors: Theory, Fabrication and Characterization”, Springer, 2009.

4. K. Müllen, U. Scherf, “Organic Light Emitting Devices: Synthesis, Properties and Applications”, John Wiley & Sons, 2006.

5. S.-S. Sun, N. S. Sariciftci, “Organic photovoltaics: mechanism, materials, and devices,” Taylor

& Francis, 2005.

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ELE6250 Semiconductor Device Modelling

1. Understand the role semiconductor device physics.

2. Learn the role of parasitics for developing high frequency models.

3. Analyse the models and to learn how model parameters are extracted.

4. Use available tool in the department to carry out anolog/ rf circuit design.

Syllabus

Review of Semiconductor Physics: Energy Bands Diagram and Charge Carriers Flow in Semiconductor

Hetero-Devices: Metal-semiconductor contacts; MOS Capacitor, Hetro-Junction, Hetro- Junction Bipolar Transistor; SiGe Transistor

MOSFET: Gradual Channel Approximation, Short Channel and Narrow Channel Effects, Charge Control Models

Compact Models of Transistors: Different Types of Compact Models; BSIM and HiCUM Models: Large Signal Models; Small-Signal Models; Parameter Extraction, Noise Models;

Effect of Parasitics at High Frequency

RF Modeling of MOSFET: Modeling of Gate Resistance; Modeling of Substrate Network; RF MOSFET Models and Their Applications for GHz Communication ICs

References:

1. Y. P. Tsividis, Operation and Modeling of the MOS Transistor, McGraw-Hill Inc, 1988.

2. Y. Cheng, C. Hu, MOSFET Modelling and BSIM3 User Guide, Kluwer Academic Publishers, 1999.

3. T. Ytterdal, Y. Chang and T.A. Fjeldly, Device Modeling for Analog and RF CMOS Circuit Design, Wiley, 2004

4. W. Liu and C. Hu, BSIM4 and MOSFET Modelling Simulation, World Scientific Publication, Singapore, 2011.

5. M. Schroter, A. Chakravorty, Compact Hierarchical Bipolar Transistor Modelling with HiCUM, World Scientific Publication, 2010

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ELE6270 VLSI Architectures for DSP

1. To understand different techniques for designing efficient DSP architectures.

2. To understand the design of programmable DSP processor.

3. To design VLSI architectures of a given DSP algorithm.

Syllabus

Introduction, Representation of DSP Systems, Pipelining and Parallel Processing, Number Representation, Iteration Bound, Retiming, Unfolding and Folding, Systolic Architecture, Distributed Arithmetic, Redundant Arithmetic, CORDIC, Algorithmic Strength Reduction, Digital Filter Architectures, Scaling and Roundoff Noise, Clock Skew and Clock Distribution, Programmable DSP Processor

References:

1. K. K. Parhi, “VLSI Digital Signal Processing Systems Design and Implementation”, John Wiley and Sons, 1999

2. Uwe-Meyer Baese, “Digital Signal Processing with Field Programmable Gate Arrays”, Springer Third Edition, 2007.

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ELC6100 Nano-Electronics Devices

Credits : 4

Course Category : Program Core (II Semester) Pre-requisite(s) :

Contact Hours (L-G-P) : 3-1-0

1. Understand the transistors and other devices to smaller and smaller sizes.

2. Learn challenges and potential nanotechnological solution.

3. Analyze Ballistic Transport in Solids and Nanostructures.

4. Design New device structure using Industry standard tool for Nano-technology.

Syllabus

Nanoelectronics Materials and Devices: Review of MOS Devices and Transport Mechanism;

Semiconductor Heterostructures; Nanowires; Carbon Nanomaterials: Nanotubes: Graphene Nano Ribbon, Nanoelectronics Devices

Electron Transport in Semiconductors and Nanostructures: Ballistic and Diffusive Transport:

E-k Relationship, Drude Formula, Statistical Distribution of the Electrons in Solids and Nanostructures: Fermi Statistics, Density of States of Electrons; Transport in Nanostructures.

Electrons in Low-dimensional Structures: Electrons in Quantum Wells; Control of Charge Transfer; Electrons in Quantum Wires and Their Transport Phenomenon, Electrons in Quantum Dots and Their Applications

References:

1. Y. Taur and T. H. Ning, Fundamentals of Modern VLSI Devices, Cambridge University Press, 2008

2. S. M. Lindsay, Introduction to Nano Science, Oxford University Press, 2009

3. Supriyo Dutta, Lessons from Nanoscience: A Lecture Note Series, World Scientific 2012.

4. Supriyo Dutta, Quantum Transport- Atom to Transistor, Cambridge University Press, 2005.

5. Vladimir V. Mitin, Introduction to Nanoelectronics: Science, Nanotechnology, Engineering and Applications, Cambridge University Press, 2008.

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Course Number and Title : ELC6200

Digital Circuit Design

Credits : 4

1. Understand arithmetic building blocks, memory interconnect and timing issues.

2. Learn the design flow of digital circuits and uses of EDA tools.

3. Analyse arithmetic circuits, SRAM and Interconnects.

4. Design arithmetic circuits, interconnect and SRAM to meet the given specifications.

Syllabus

Review of Combinational, Sequential Circuit Design in CMOS and Design Methodology Design of Arithmetic Building Blocks: Introduction, Adder Circuit and Logic Design Considerations, Multiplier Design, Design of Barrel and Logarithmic Shifters; Power and Speed Trade-offs in Data Path Structures: Design Time and Run Time Power Management, Power Reduction in Sleep Mode.

Design of Memory and Array Structures: Memory Architectures and Building Blocks, ROM, Non-Volatile Read Write Memories, CAM, DRAM, SRAM cell and Array Design; Memory Peripheral Circuitry: Address Decoders, Sense Amplifiers, Voltage References, Drivers/Suffers; Timing and Control, Power Dissipation.

Interconnect, Power Grid and Timing Issues: Interconnect Resistance and Capacitance, RC Delay, Crosstalk, Power Distribution Design, Synchronous Design, Concept of Self Timed Circuit Design, PLL and Delay Locked Loop, Clock Synthesis and Synchronization Using PLLs and DLLs, Multiple Clock Domains.

References:

1. J. M. Rabaey, A. Chandrakasan and B. Nikolic, Digital Integrated Circuits: A Design Perspective; Pearson, 2nd edition, 2016.

2. D. A. Hodges, H.G. Jackson and R.S. Saleh, Analysis and Design of Digital Integrated Circuits, 3rd edition McGraw Hill, 2003.

3. S. M. Kang and Y. Leblebici, CMOS Digital Integrated Circuits: Analysis and Design, 3rd edition, McGraw Hill, 2002.

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Course Number and Title

: ELC6110 Analog Circuit Design

1. Understand the MOSFET device models.

2. Understand the design flow of analog circuits using EDA tools.

3. Analyse a given analog circuit.

4. Design analog circuits at the transistor level to meet a given specifications.

Syllabus

Review of MOSFETs Models: Large Signal, Small Signal and High Frequency Models, Introduction to Analog Design.

Design of CMOS Based Single Stage: CS, CG, CD and Cascode; Differential Amplifiers, MOS Current Mirrors, Voltage References (Band Gap References).

Frequency Response of Amplifiers, Noise, Frequency Compensation, Design of Single and Two Stage MOS Operational Amplifiers.

Introduction to Switched Capacitor Amplifiers, Non-Linearity, Mismatches; Basic Concepts of RF Circuits Design.

References:

1. Behzad Razavi, Design of Analog CMOS Integrated Circuits, Tata McGraw Hill, 2002.

2. P.E. Allen and D.R. Holberg, CMOS Analog Circuit Design, Oxford University Press, 2011.

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ELC6120 Current Mode Circuits and Systems

1. Understand the current-mode building blocks and their models.

2. Analyse current mode circuits.

3. Design the current-mode circuits with systems.

4. Use available CAD Tool for design and testing of current-mode circuits.

Syllabus

Building Blocks: Current Mode vs Voltage Mode, CMOS Current Mode Building Blocks, Current Controlled Conveyors and Differential Voltage Current Conveyors Their Design Consideration.

Current-Mode Circuits: CCII Based Circuits: Design and Applications; Translinear-C Circuits:

Electronically Tuneable Circuits; Non-Idealities and Frequency Limitations of the Current Mode Circuits.

Current-Mode Systems and Their Applications: Analog Interface Circuits for VLSI, Current Mode Data Converters, PID controllers, FPAAs, Multipliers, Use of Current-Mode ICs for Linear, Non-Linear Circuits; Realization of Current-Mode Building Blocks.

References:

1. R. Senani, D. R. Bhaskar, A. K. Singh, Current Conveyors: variants, applications and hardware implementations, Springer, 2016.

2. Toumazou, F. J. Lidgey and D. H. Haigh, Analogue IC Design: the current mode approach, IEE Press, reprint 2014.

3. F. Yuan, CMOS Current mode circuits for Data Communication, Springer, 2006.

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ELC6130 Analog Filter Design

1. Understand various techniques for designing active-RC filters.

2. Analyze and design Transconductance-C filters.

3. Analyze and design Switched capacitor filters.

4. Understand tuning and feasibility aspects of analog filters.

Syllabus

Filter Concepts and Classification; Continuous-Time Active-RC Filters: Design and Non-Ideal Effects; Approaches for Higher Order Filter Design

Design of Transconductance-C Filters: Effects of OTA Non-Idealities, Tuning and Integration Aspects; MOSFET-C Filters.

Introduction to Switched Capacitor (SC) Filters, Resistor Emulation, SC Building Blocks, Design of SC Filters, Advantages and Limitations.

Design of Mixed-Mode and Electronically Tunable Filters, SAW Filters, Standard Filter ICs.

References:

1. R. Schauman, M E Van Valkenburg, Design of Analog Filters, Oxford University Press, 2005.

2. Y. Sun, Circuit Devices & Systems, Design of High Frequency Integrated Analogue Filters, IEE Publishing, 2002.

3. T. Parveen, Textbook of Operational Transconductance Amplifier and Analog Integrated Circuits, I.K. International New Delhi, 2009.

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Course Number and Title : ELC6150

RF Circuits & Systems

1. Understand key concepts related to RF.

2. Analyze and design RF circuits from a given specifications.

3. Understand the trade-off among different transceiver architecture used in RF systems.

4. Understand the design of key blocks of a transceiver keeping in view the system requirements using CAD Tool.

Syllabus

Fundamentals of RF Circuits and Systems: Gain Compression, Intermodulation Distortion, Noise Figure, Sensitivity and Dynamic Range, Wireless Standards.

Transmitter and Receiver Architectures: Review of Digital Modulation Techniques, Receiver Architectures, Transmitter Architectures

RF System Level Specifications: Derivations of RF Circuits Specifications from Wireless Communication Standards, Noise and Linearity in RF System.

Design of RF System (Transceiver) Building Blocks: Design Goals and Objectives; LNA:

Terminated Resistor CS and CG LNA, Inductive Degenerated LNA, Noise Cancelling and Linearity Improvement Techniques; PA: different Classes of PA Operation: Design of class C and Switched Mode PA, Introduction to Other Blocks of RF System

References:

1. B. Razavi, RF Microelectronics, 2^nd ed. Prentice Hall, 2012.

2. T.H. Lee, The Design of CMOS Radio Frequency Integrated Circuits, Cambridge University Press, 2^nd ed., 2004.

3. Kai Chang, Inder Bahal and Vijay Nair, RF and Microwave Circuit and Component Design for Wireless System, Wiley, 2002.

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ELC6200 Digital Circuit Design

Credits : 4

1. Understand arithmetic building blocks, memory interconnect and timing issues.

2. Learn the design flow of digital circuits and uses of EDA tools.

3. Analyse arithmetic circuits, SRAM and Interconnects.

4. Design arithmetic circuits, interconnect and SRAM to meet the given specifications.

Syllabus

Review of Combinational, Sequential Circuit Design in CMOS and Design Methodology Design of Arithmetic Building Blocks: Introduction, Adder Circuit and Logic Design Considerations, Multiplier Design, Design of Barrel and Logarithmic Shifters; Power and Speed Trade-offs in Data Path Structures: Design Time and Run Time Power Management, Power Reduction in Sleep Mode.

Design of Memory and Array Structures: Memory Architectures and Building Blocks, ROM, Non-Volatile Read Write Memories, CAM, DRAM, SRAM cell and Array Design; Memory Peripheral Circuitry: Address Decoders, Sense Amplifiers, Voltage References, Drivers/Suffers; Timing and Control, Power Dissipation.

Interconnect, Power Grid and Timing Issues: Interconnect Resistance and Capacitance, RC Delay, Crosstalk, Power Distribution Design, Synchronous Design, Concept of Self Timed Circuit Design, PLL and Delay Locked Loop, Clock Synthesis and Synchronization Using PLLs and DLLs, Multiple Clock Domains.

References:

1. J. M. Rabaey, A. Chandrakasan and B. Nikolic, Digital Integrated Circuits: A Design Perspective; Pearson, 2nd edition, 2016.

2. D. A. Hodges, H.G. Jackson and R.S. Saleh, Analysis and Design of Digital Integrated Circuits, 3rd edition McGraw Hill, 2003.

3. S. M. Kang and Y. Leblebici, CMOS Digital Integrated Circuits: Analysis and Design, 3rd edition, McGraw Hill, 2002.

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Course Number and Title

: ELC6210 VLSI Technology

1. Design diffusion, ion implantation, oxidation process steps for desired characteristics.

2. Design etching process to get desired pattern on the wafer.

3. Design process steps to deposit a film of desired material and desired thickness &

characteristics.

4. Integrate process steps for manufacturing a device of desired characteristics.

Syllabus

Environment for VLSI Technology: Clean Room and Safety Requirements. Wafer Cleaning Processes. Impurity Incorporation: Diffusion, Ion Implantation Modeling and Technology and Damage Annealing; Thermal Oxidation: Kinetics of Silicon Dioxide Growth Both for Thick, Thin and Ultrathin Films.

Lithography: Photolithography, E-beam Lithography and Newer Lithography Techniques for VLSI/ULSI; Mask Generation. Etching: Dry and Wet Etching Process and Modeling, Plasma Etching and RIE Techniques.

Thin Film Deposition: CVD Techniques for Deposition of Polysilicon, Silicon Dioxide, Silicon Nitride and Metal Films; Epitaxial Growth of Silicon; Modeling and Technology. Metal film Deposition: Evaporation and Sputtering Techniques. Failure Mechanisms in Metal Interconnects; Multi-Level Metallization Schemes.

Process Integration for NMOS, CMOS and Bipolar Circuits; Advanced MOS Technology;

GaAs Technology; BiCMOS Technology. Introduction to Process Simulation Using TCAD Tools

References:

1. J. D. Plummer et al., Silicon VLSI Technology: Fundamentals, Practice and Modeling, 1^st Ed, Pearson.2009

1. S. A. Campbell, The Science and Engineering of Microelectronic Fabrication, 2^nd Ed, Oxford University Press.2001

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ELC6220 Advance Digital System Design

1. Understand the design flow of digital systems.

2. Use Verilog HDL for the modelling of Digital Systems.

3. Design digital systems from a given specifications.

4. Implement the design in IC technologies like ASICs and FPGA using EDA tool.

Syllabus

VLSI Design Problem, IC Design Hierarchy, Uni-Processor Systems, Pipelined and Parallel Systems, Introduction to Verilog HDL, Structural, Dataflow and Behavioral Modeling

Design Verification Techniques, Concept of Synthesis, Synthesizable Verilog Coding, FSM, Implementation Technologies (ASIC, PLDs and FPGA),

Design of RTL Systems, Data and Control Subsystems; Design of Simple Stored Program Machine

Number Representation (Fixed Point), Introduction to DSP Algorithms (FIR filter) and its FPGA Implementation, Introduction to System Verilog.

References:

1. M.D. Ciletti, Advanced Digital Design with the Verilog HDL, Prentice Hall of India, 2008.

2. C. Roth, L.K. John and B.K. Lee, Digital System Design using Verilog, Global Engineering Publishers, 2016

3. K. Parhi, VLSI Architecture for DSP, Wiley 2001.

4. Milos D. Ercegovac, Tom’s Lang, Jaime H. Moreno, Introduction to Digital System, John Wiley & Sons 2000.

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ELC6310 Embedded Systems

1. Gain knowledge about Embedded Systems blocks.

2. Differentiate between various processors used for designing Embedded Systems.

3. Interface Memory, Input/Output devices and other peripherals.

4. Design microcontroller based embedded system Syllabus

Embedded System: Introduction, Processor in the System, Hardware and Software Units, Embedded System-On-Chip (SOC), Structural Units in a Processor, Selection for an Embedded System;

Memory Devices: Memory Selection for an Embedded System, Allocation of Memory to Program Segments and Blocks, Memory Map of a System; Interfacing Processor, Memories and I/O Devices.

Intel's series of Micro-Controllers, Design Case Study Using 8051, A/D Converters and Other Peripherals Devices and Its Applications.

Introduction to PIC Microcontrollers - C Programming for PIC - PIC Development Tools - LED and LCD Interface and Programs - serial Communication - Analog Interfacing - Sensor Interfacing, Introduction to Real-Time Operating Systems and ARM Processor.

References:

1. John B Peatman, Design with PIC Microcontrollers, Pearson Education, Eighth impression, 2009.

2. Muhammad Ali Mazidi, Rolin D. Mckinlay, Danny Causey, PIC Microcontroller and Embedded Systems using Assembly and C for PIC18, Pearson Education, 2012.

3. Rajkamal, Embedded Systems Architecture, Programming and Design, Tata McGraw Hill book Co, New Delhi, 2008.

4. Jonathan W. Valvano, Embedded Microcomputer Systems, Real Time Interfacing, 3^rd edition, Cengage Learning, 2011

5. Steve Furber, ARM, System-on-Chip Architecture, 2^nd Edition, Pearson Education, 2012.

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ELE6120 Analog Signal Processing

1. Understand the fundamental properties of different types of analog processing blocks.

2. Analyze different types of analog signal processing blocks.

3. Design of different analog signal processing blocks.

Syllabus

Amplifiers: Introduction to Analog Signal Processing, Tuned Amplifiers, Programmable Amplifiers, Feedback Amplifiers, Current Feedback Op Amp, Norton Amplifier, Noise and Distortions Study

Oscillators: Quadrature Oscillators, Voltage-Controlled Oscillators and Digitally Controlled Oscillators. triangular to Sinusoidal Wave Converters. HF Oscillators. Amplitude Stabilization.

Multipliers: Log and Antilog Amplifiers. Analog Multiplier Circuits. Four Quadrant Multipliers with n (n>2) Inputs. Four Quadrants Variable Transconductance Multiplier.

Phase Locked Loops: Simple PLL, Charge Pump PLL, Non Ideal Effect in PLL and Applications of PLL. Communication Circuits

References:

1. Adel S. Sedra, Kenneth Carless Smith, Microelectronic Circuits, Oxford University Press, 2014.

2. Behzad Razavi, Fundamentals of Microelectronics, Wiley Publication, 2014

3. Ramon Pallas-Areny, John G. Webster, Analog Signal Processing, Wiley Publication, 2011