EE352N
ELECTRICAL AND ELECTRONIC
INSTRUMENTATION – CHAPTER V
1
GLOBAL POSITIONING SYSTEM - Overview
• Official name of GPS is NAVigational Satellite Timing And Ranging Global Positioning System (NAVSTAR GPS)
• Global Positioning Systems (GPS) is a form of Global Navigation Satellite System (GNSS)
– Only completely functional one of its kind at this time
• First developed by the United States Department of Defense.
• Consists of two dozen GPS satellites in medium Earth
orbit (The region of space between 2000km and 35,786
km)
Overview (continued)
• Made up of two dozen satellites working in unison are known as a satellite constellation.
• This constellation is currently controlled by the United States Air Force 50th Space Wing.
• Mainly used for navigation, map-making and
surveying.
Operation Overview
A GPS receiver can tell its own position by using the position data of itself, and compares that data with 3 or more GPS satellites.
To get the distance to each satellite, the GPS transmits a signal to each satellite.
The signal travels at a known speed.
The system measures the time delay between the signal transmission and signal reception of the GPS signal.
The signals carry information about the satellite’s location.
Determines the position of, and distance to, at least three satellites, to reduce error.
The receiver computes position using trilateration.
Trilateration
GPS Functionality
• GPS systems are made up of 3 segments
– Space Segment (SS)
– Control Segment (CS)
– User Segment (US)
Control Segment Space Segment
User Segment
Three Segments of the GPS
Monitor Stations
Ground Antennas Master Station
Space Segment
• GPS satellites fly in circular orbits at an altitude of 20,200 km and with a period of 12 hours.
•
• Powered by solar cells, the satellites continuously orient themselves to point their solar panels toward the sun and their antenna toward the earth.
• Orbital planes are centered on the Earth.
• Each planes has about 55° tilt relative to Earth's
equator in order to cover the polar regions.
Space Segment (Continued)
• Each satellite makes two complete orbits each sidereal day.
– Sidereal - Time it takes for the Earth to turn 360 degrees in its rotation
• It passes over the same location on Earth once each day.
• Orbits are designed so that at the very least,
six satellites are always within line of sight
from any location on the planet.
Space Segment (Continued)
• There are currently 30 actively broadcasting satellites in the GPS constellation.
• Redundancy is used by the additional satellites to improve the precision of GPS receiver calculations.
• A non-uniform arrangement improves the
reliability and availability of the system over
that of a uniform system, when multiple
satellites fail
Control Segment
• The CS consists of 3 entities:
– Master Control System – Monitor Stations
– Ground Antennas
Kwajalein Atoll US Space Command
Control Segment
Hawaii
Ascension Is. Diego Garcia Cape Canaveral
Ground Antenna Master Control Station Monitor Station
Master Control Station
• The master control station, located at Falcon Air Force Base in Colorado Springs, Colorado, is responsible for overall management of the remote monitoring and transmission sites.
• GPS ephemeris is the tabulation of computed
positions, velocities and derived right ascension
and declination of GPS satellites at specific times
for eventual upload to GPS satellites.
Monitor Stations
• Six monitor stations are located at Falcon Air Force Base in Colorado, Cape Canaveral, Florida, Hawaii, Ascension Island in the Atlantic Ocean, Diego Garcia Atoll in the Indian Ocean, and Kwajalein Island in the South Pacific Ocean.
• Each of the monitor stations checks the exact
altitude, position, speed, and overall health of
the orbiting satellites.
Monitor Stations (continued)
• The control segment uses measurements collected by the monitor stations to predict the behavior of each satellite's orbit and clock.
• The prediction data is transmitted, to the satellites for transmission back to the users.
• The control segment also ensures that the GPS satellite
orbits and clocks remain within acceptable limits. A
station can track up to 11 satellites at a time.
Monitor Stations (continued)
• This "check-up" is performed twice a day, by each station, as the satellites complete their journeys around the earth.
• Variations such as those caused by the gravity
of the moon, sun and the pressure of solar
radiation, are passed along to the master
control station.
Ground Antennas
• Ground antennas monitor and track the satellites from horizon to horizon.
• They also transmit correction information to
individual satellites.
User Segment
• The user's GPS receiver is the US of the GPS system.
• GPS receivers are generally composed of an antenna, tuned to the frequencies transmitted by the satellites, receiver-processors, and a highly-stable clock, commonly a crystal oscillator).
• They can also include a display for showing location and speed information to the user.
• A receiver is often described by its number of channels
this signifies how many satellites it can monitor
simultaneously. As of recent, receivers usually have
between twelve and twenty channels.
Navigational Systems
• GPS satellites broadcast three different types of data in the primary navigation signal.
– Almanac – sends time and status information about the satellites.
– Ephemeris – has orbital information that allows the receiver to calculate the position of the satellite.
• This data is included in the 37,500 bit Navigation Message, which takes 12.5 minutes to send at 50 bps.
Navigational Systems (cont’d)
• Satellites broadcast two forms of clock information
– Coarse / Acquisition code (C/A) - freely available to the civilians.
– The C/A code is a 1,023 bit long pseudo-random code broadcast at 1.023 MHz, repeating every millisecond.
– Restricted Precise code (P-code) - reserved for military usage. The P-code is a similar code broadcast at 10.23 MHz, but it repeats only once a week.
– Information is encrypted and needs key to access.
Position Calculation
• The satellites are equipped with atomic clocks
• Receiver uses an internal crystal oscillator-based clock that is continually updated using the signals from the satellites.
• Receiver identifies each satellite's signal by its
distinct C/A code pattern, then measures the
time delay for each satellite.
Position is Based on Time
t2
Distance between satellite and
receiver = “(t2-t1) times the speed of light”
t1
Signal leaves satellite at time “t1”
Signal is picked up by the
receiver after time “t2-t1”
Pseudo Random Noise Code
Receiver pulse
Identical to satellite pulse
Satellite pulse received at the reciever.
Time
Difference
Coded pulses are received by receiver by Almanac and contains the identity of the satellite.
Position Calculation (cont’d)
• The receiver emits an identical C/A sequence using the same code the satellite used.
• By aligning the two sequences, the receiver can measure the delay and calculate the distance to the satellite, called the pseudorange.
• Orbital position data from the Navigation
Message is used to calculate the satellite's
precise position.
Signal From One Satellite
The receiver is
somewhere on this sphere.
Knowing the position and the distance of a satellite indicates that the receiver is located somewhere on the surface of an imaginary sphere centered on that satellite and whose radius is the distance to it as shown above.
Signals From Two Satellites
Knowing the position and the distance from second satellite also indicates that the receiver is located somewhere on the circle formed by the two surfaces of imaginary spheres centered on the two satellites and whose radius is the distance to it.
The receiver is somewhere on this circle .
Signals From Two Satellites
The receiver is at one of the two points shown by yellow points
Thus for finding out 2D position of reciever, 3 satellites are must. Known as Trilateration
Three Dimensional (3D) Positioning
Forfinding out 3D position of reciever, 4 satellites are must.
Triangulating Correct Position
Position Calculation (cont’d)
• Orbital position data from the Navigation
Message is used to calculate the satellite's
precise position.
Position Calculation (cont’d)
• When four satellites are measured at the same time, the point where the four imaginary spheres meet is recorded as the location of the receiver.
• Earth-based users can substitute the sphere of the planet for one satellite by using their altitude.
Often, these spheres will overlap slightly instead
of meeting at one point, so the receiver will yield
a mathematically most-probable position.
Issues That Affect Accuracy
• Changing atmospheric conditions change the speed of the GPS signals as they pass through the Earth's atmosphere and ionosphere.
– Effect is minimized when the satellite is directly overhead
– Becomes greater for satellites nearer the horizon, since the signal is affected for a longer time.
– Once the receiver's approximate location is
known, a mathematical model can be used to
estimate and compensate for these errors.
Issues That Affect Accuracy (cont’d)
• Clock Errors can occur when, for example, a GPS satellite is boosted back into a proper orbit.
– The receiver's calculation of the satellite's position will be incorrect until it receives another
ephemeris update.
– Onboard clocks are accurate, but they suffer from
partial clock drift.
Issues That Affect Accuracy (cont’d)
• GPS signals can also be affected by multipath issues
– Radio signals reflect off surrounding objects at a location. These delayed signals can cause
inaccuracy.
– Less severe in moving vehicles. When the GPS antenna is moving, the false solutions using
reflected signals quickly fail to converge and only
the direct signals result in stable solutions.
Sources of Signal Interference
Earth’s Atmosphere
Solid Structures
Metal Electro-magnetic Fields
Receiver Errors are Cumulative!
User error = +- 1 km
System and other flaws = < 9 meters
GPS Satellite Geometry
Satellite geometry can affect the quality of GPS signals and accuracy of receiver trilateration.
Dilution of Precision (DOP) reflects each satellite’s position relative to the other satellites being accessed by a receiver.
There are five distinct kinds of DOP.
Position Dilution of Precision (PDOP) is the DOP value used most commonly in GPS to determine the quality of a receiver’s position.
It’s usually up to the GPS receiver to pick satellites which provide the best position triangulation.
Some GPS receivers allow DOP to be manipulated by the user.
Ideal Satellite Geometry
N
S
W E
Position Dilution of Precision (PDOP)
Good Satellite Geometry
Good Satellite Geometry
Poor Satellite Geometry
N
S
W E
Poor Satellite Geometry
Poor Satellite Geometry
DGPS Site x+30, y+60
x+5, y-3
True coordinates = x+0, y+0
Correction = x-5, y+3 DGPS correction = x+(30-5) and
y+(60+3)
True coordinates = x+25, y+63
x-5, y+3
Differential GPS
DGPS Receiver Receiver
Methods of Improving Accuracy (cont’d)
• Augmentation
– Relies on external information being integrated into the calculation process.
– Some augmentation systems transmit additional information about sources of error.
– Some provide direct measurements of how much the signal was off in the past
– Another group could provide additional
navigational or vehicle information to be
integrated in the calculation process.
GLOBAL POSITIONING SYSTEM - WAYPOINTS
• A waypoint is based on coordinates entered into a GPS receiver’s memory.
• It can be either a saved position fix, or user entered coordinates.
• It can be created for any remote point on earth.
• It must have a receiver designated code or number, or a user supplied name.
• Once entered and saved, a waypoint remains unchanged in the receiver’s memory until edited or deleted.
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Start = Waypoint
PLANNING A NAVIGATIONAL ROUTE
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HOW A RECIEVER SEES YOUR ROUTE
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GPS NAVIGATION TERMINOLOGY
N(0000)
(00)
N Desired Track
(DTK) (xº)
Present Location
Tracking (TRK) (xº)
Active GOTO Waypoint
Course Made Good (CMG) (CMG) (xº)
50
GPS NAVIGATION-ON THE GROUND
Active GOTO Waypoint
Bearing =
Course Over Ground (COG) = Cross Track Error (XTE) =
Location Where GOTO Was Executed
Bearing = 650 COG = 50 XTE = 1/2 mi.
Bearing = 780 COG = 3500 XTE
= 1/3 mi.
Bearing = 400 COG = 1040 XTE
= 1/4 mi.
N
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ELECTROMECHANICAL METER
• Has a spinning disc and a mechanical counter display.
• Operates by counting the revolutions of a metal disc.
• Speed is proportional to the power drawn i.e. ω=K v i
• Nearby coils spin the disc by inducing eddy currents and a force proportional to the instantaneous current and voltage.
• A Permanent magnet exerts a damping force on the disc.
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SOLID-STATE ELECTRONIC METERS
•
These devices digitize the instantaneous voltage and current via a high-resolution ADC.•
A microprocessor multiplies voltage and current to give the instantaneous power in watts.•
Integration over time gives energy used in kilowatt hours (kWh).
•
The energy data is displayed on a liquid-crystal display (LCD).•
It also measures other parameters such as power factor and reactive power.53
COMMUNICATION
•
Modes of meter reading:1) Walk by 2) Drive by 3) Network Connection
54
•
A smart meter records the energy consumption for the specified interval (half or one hour) of time for which it is programmed.•
This meter has a facility to store the data recorded in the interval and reproduce it whenever required.•
These meters enable a two-way communication between the meter and the central system.•
These meters are embodied with the feature of monitoring the quality of the power.SMART METERS
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SMART METERS
POWER CONSUMPTION (MW)
PEAK HOURS
HOURS
0500 0700 0900 1100 1300 1500
0300
0100
2300
21001900
1700
OFF-PEAK
HOURS ELECTRIC UTILITY IS UNDER UTILIZED ADDITIONAL PLANTS
OPERATED
•
Better utilization of utilities.PLANT CAPACITY
1500
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SMART METERS
•
Higher rates during peak hours and lower during non-peak hours.•
This allows savvy consumers to save money by running major appliances, such as washers and dryers, during lower-cost, off-peak periods. This can also be controlled by the utility.•
Better Demand Side Management.•
Economical and flexible operation.•
Prevention of frauds and power-thefts.•
Quick fault detection and fault clearing.57
SMART METERS
BASIC BLOCK DIAGRAM OF A SMART METER 58
SMART METERS
•
Interconnection to premise-based networks and devices (e.g., distributed generation).•
Ability to read other, on-premise or nearby commodity meters (e.g., gas, water).•
Can better manage number of Hybrid Electric Vehicles on road.•
A technology known as Power line Carrier Systems (PCS) is used to send coded signals along a home's existing electric wiring to programmable switches.•
PCS transmitter send this signal into power line which can be tapped from any power outlet at home.59
SMART METERS-COMMUNICATION WITH UTILITY
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SMART METERS
•
Smart Meter Plays an important role in a Smart Grid.DSM
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WIDE AREA MEASUREMENT SYSTEMS
•
Wide Area Measurement monitor network stability of the power system network.•
It includes States (V and δ) determination and grid imbalance (voltage stability, phase Imbalance).•
Observability – If all the states (V & δ) can be measured or calculated using the existing measurement data then the system is said to be observable.62
WIDE AREA MEASUREMENT SYSTEMS- OBSERVABILITY
(V,δ,I1,I2) Meter
I1 1
2
3
I2
4
(V,δ,I1,I3, I4)
I1 1
2
3
I3
4 Meter
I4
Unobservable System Observable System
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WIDE AREA MEASUREMENT SYSTEMS
• Disturbance recording.
• Network safety.
• Generation control.
• Improved planning will also result from the data gathered from WAMS.
• Supervisory Control and Data Acquisition SCADA / PMU.
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WIDE AREA MEASUREMENT SYSTEMS
•
In short, SCADA has following functions:1. Data acquisition
2. Supervisory control
3. Alarm display and control
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WAMS-STATE ESTIMATION
Z=h(X)+ϵ
Z – Measurement vector.
X – states of system (V,δ)
h- function relating X with Z (A theoretical relation between measured quantity and states).
ϵ- Noise in measurement or error.
Real and Reactive Power Flows Pij = F1(Vi,Vj, δi, δj)
Qij = F2(Vi,Vj, δi, δj)
Real and Reactive Power Injections Pi = F(Vi,Vj, δi, δj)
Qi = F(Vi,Vj, δi, δj)
where j belongs to all the buses connected to bus i.
These are the functions h(X) relating Power injections and Power flows to States of the system
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WAMS-STATE ESTIMATION
•
To estimate correct values of states from the measured data, state estimation is done.•
Estimation is done such that mean error ϵ or mean square error ϵTϵ is minimized. i.e. (Z-h(X))T (Z-h(X))STEPS
1. Assume initial values of states (Vo, δo).
2. Calculate values of measured quantities by theoretical relation h(X).
3. There will be error in measured value Z and calculated value h(X).
4. Calculate error ϵ=Z-h(X) or mean square error ϵTϵ.
5. Based on this error update (modify) state vector X.
6. If this updated state vector X(V1, δ1) is very near to old state vector X0(Vo, δo), stop estimation. X(V1, δ1) is estimated value.
7. If this updated state vector X(V1, δ1) is not close to old state vector X0(Vo, δo), Goto step 2.
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WAMS-STATE ESTIMATION
•
SCADA data is very slow. In appropriate for dynamic studies.•
Voltage angles cannot be measured, but rather estimated using the data of WAMS.•
The estimated value of voltage angles has low accuracy.68
At different locations
SUBSTATION A SUBSTATION B
t = t1 t = t1
Measurement at Substation A Measurement at Substation B
V Phasors of station A and station B
Figure 2: Synchrophasor Measurements
69
SYNCHROPHASOR MEASUREMENTS
δ
• Synchrophasor measurements are synchronized with common time reference.
• Along with the measurements, the exact time of the measurement is also included.
• Angle difference between two phasors can be compared.
• Phasor Measurement Units are such devices.
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SYNCHROPHASOR MEASUREMENT
• PMUs measure Voltage of the bus on which it is placed, Voltage angle and Currents & Current angles of the branches connected to the bus.
• It is synchronized with Satellite atomic clock via some communication channel.
• High-speed synchronized sampling with 1 microsecond accuracy.
• Voltage and Voltage angles of the neighboring buses can be estimated.
• A PMU converts a non-linear estimator into a linear estimator.
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PHASOR MEASUREMENT UNITS
PHASOR MEASUREMENT UNITS
ANTI-ALIASING FILTERS
16-BIT A/D CONVERTER PHASE-LOCKED
OSCILLATOR GPS RECEIVER
PHASOR
MICROPROCESSOR
MODEM Analog Inputs
(From CT, PT etc)
Phasor Measurement Unit Block Diagram
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WAMPS-ONLY PMUs
73
PMU PMU PMU PMU PMU PMU
DATA STORAGE PMUs/Meters located in Sub-Stations
SUPER DATA CONCENTRATOR
DATA CONCENTRATOR
DATA CONCENTRATOR
Wide Area Measurement System
• Present cost of a Phasor Measurement Unit is very high.
• Hence, Placed at selective (optimal) locations.
• Therefore in actual practice, WAMS of present day power system network includes conventional measurements with PMUs placed at optimal locations.
• PMU cost is expected to go down in recent years.
• Real potential of Synchrophasor Measurements is yet to be explored.
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SMART SENSORS
• At a minimum, A Smart Sensor is the combination of a sensing element with processing capabilities provided by a microprocessor.
• Smart Sensors are basic sensing elements with embedded intelligence.
• The sensor signal is fed to the microprocessor, which processes the data and provides an informative output to an external user.
• It is a complete self-contained sensor system that includes the capabilities for logging, processing with a model of sensor response and other data, self-contained power, and an ability to transmit or display informative data to an outside user.
• . 75
SMART SENSORS
Integration of silicon microprocessors with sensor technology can not only provide interpretive power and customized outputs, but also significantly improve sensor system performance and capabilities.
76
APPLICATIONS - SMART SENSORS
• Awareness of our surroundings
• Provide safety.
• Security, and Surveillance.
• Enable monitoring of our health
• Enable monitoring of our Environment.
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SMART SENSORS
The smart sensor possesses several functional layers
• Signal detection from discrete sensing elements
• Signal processing, data validation and interpretation
• Signal transmission and display.
SENSORS
Analog-Digital-Analog Signal Processing
Communications Electrical/Optical
Physical/Chemical Stimulus
SMART SENSOR SYSTEM
Processed
Sensor Information to User
User Commands for sensor
Operations
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POWER
SMART SENSORS
• Multiple sensors can be included in a single smart sensor system whose operating properties, such as bias voltage or temperature, can be set by the microprocessor.
• The sensor elements interface to signal control and conditioning stages that will provide both excitation and signal data logging and conditioning.
• The data acquisition layer will convert the signal from analog to digital and acquire additional parameters of interest to provide compensation when needed.
• Compensation is provided for thermal drift, long term drift, etc.
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SMART SENSORS
• The processed data becomes information and can then be transmitted to external users.
• The user can choose the complexity of the data transmitted:
from a single reading to a complete download of the sensor system’s parameters.
• Intelligent features can be included at the sensor level like: self- calibration, self-health assessment, self-healing, and compensated measurements (auto zero, calibration, temperature, pressure, relative humidity correction).
• A Smart Sensor is thus self-aware and can assess its own health or status and assess even the validity of the processed data. 80
SMART SENSORS
• The smart sensor system can optimize the performance of the individual sensors for better understanding the measurement, and the environment in which the measurement is made.
• It is adaptable to a changing environment.
81
SMART SENSORS-NETWORKS
• New generation of smart sensors can be networked through the communication Interface.
• They have the capability of individual network self-identification and communication allowing reprogramming of the smart sensor system as necessary.
• The output from a number of sensors within a given region can be correlated not only to verify the data from individual sensors, but also to provide a better situational awareness.
• Such communication can be between a single smart sensor and communication hub or between individual smart sensors
themselves. 82
SMART SENSORS-ADVANCEMENTS
• There are many examples of technology advancements in sensors, power, and communications that can enable future smart sensor systems.
GOALS
• Cost-effective, reliable, self-monitoring, reconfigurable, and can operate indefinitely.
ACHIEVED THROUGH
• Advanced Microprocessor technology, MEMS, sensor elements, micro-fabrication and nanotechnology.
83
LOW POWERED SENSOR ELEMENTS
• Example – Sensor based on a microhotplate.
• Microfabricated hotplates offer a lower power platform for high temperature metal oxide conductometric sensors.
• Heating rates up to 106 oC/s and minimal power consumption due to the small thermal mass of the microhotplates.
• This sensor responds to ambient gas changes in nanoseconds having a measured transient response time-constant of 12 μs in helium.
84
LOW POWERED SENSOR ELEMENTS
85
LOW POWERED SENSOR ELEMENTS
• Temperature of the bridge, and hence electrical resistance, is a function of the thermal conductivity of the surrounding gas ambient.
• Sensitivity - 2.05 mohms/ppm for helium and 0.71ohms/ppm for methane at 3.6
• The microfabricated sensor elements shown have extremely low power consumption.
• 4 mW continuous and, <4 μW when operated on a duty cycle of millisecond.
• Can run for years on a small battery.
86
POWER: BATTERY OR ENERGY HARVESTING
• Small scale energy systems for the smart sensor applications will generally consider batteries and energy harvesting options.
• Li-ion, Li-polymer, and metal-air rechargeable batteries.
Open circuit voltage – 3.6 Volts.
Energy Density - 160 and 130-200 Wh/kg.
• Energy harvesting –
Piezoelectric crystals or fibers, thermoelectric generators, solar cells, electrostatic, and magnetic energy capture devices.
87
POWER: BATTERY OR ENERGY HARVESTING
EXAMPLE – PIEZOELECTRIC ENERGY SYSTEM.
• A piezoelectric energy system will produce a small voltage when it is physically deformed.
• Deformation can be caused by mechanical vibration that may be generated by the proper mounting of sensor in a mechanically vibrating environment.
EXAMPLE – THERMOELECTRIC GENERATORS.
• Sensitivity: 100-200 uV/°C per junction.
These two energy systems Smart Sensors can derive sufficient energy from its surroundings to provide either total or backup power for a smart sensor application.
88
SMART SENSORS - WIRELESS COMMUNICATION
• The smart sensor system will require an electrical interface that will transmit the sensor outputs to an external data collection, recording or acquisition system.
• Ideally, this interface does not require wiring and can be accomplished by wireless telemetric methods.
• MEMS technology, provides a technical approach for wireless communication system development.
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EXAMPLES – POCKET SMART SENSORS
90
EXAMPLES – LICK AND STICK LEAK SENSORS
91
92
MICRO ELECTRO-MECHANICAL SYSTEMS
(MEMS)
Micro-Electro-mechanical Systems (MEMS)
• Micro-fabrication makes the MEMS.
• Unlike Micro Electronic Circuits. MEMS have holes, cavity, channels, cantilevers, membranes, etc, and, in some way, imitate `mechanical' parts.
• This has a direct impact on their manufacturing process.
93
Micro-Electro-mechanical Systems (MEMS)
94
ENERGY DOMAINS
• Thermal (temperature, heat and heat flow)
• Mechanical(force, pressure, velocity, acceleration, position)
• Chemical(concentration, pH, reaction rate)
• Magnetic(field intensity, flux density, magnetization)
• Radiant (intensity, wavelength, polarization, phase)
• Electrical (voltage, charge, current)
95
SCALING
• Let the dimensions be scaled by factor S:
L
new= L
old *S , B
new= B
old *S , H
new= H
old *S
VOLUME: V
new= V
old *S
396
SCALING
97
SCALING
98
•
The force due to surface tension scales as S1.•
The force due to electrostatics with constant field scales as S2.•
The force due to certain magnetic forces scales as S3.•
Gravitational forces scale as S4.WATER BUG
99
•
The weight of the water bug scales as the volume, or S3,•
While the force used to support the bug scales as the surface tension (S1) times the distance around the bug’s foot (S1), and the force on the bug’s foot scales as S1 × S1 = S2.•
When the scale size, S, decreases, the weight decreases more rapidly than the surface tension forces.•
Changing from a 2-m-sized man to a 2-mm-sized bug decreases the weight by a factor of a billion, while the surface tension force decreases by only a factor of a million.•
Hence, the bug can walk on water.WATER BUG
100
GRAVITATIONAL FORCE- SCALING
101
GRAVITATIONAL FORCE- SCALING
102
• Gravitational potential energy scales as S4.
• If the dimensions of a system are scaled from meters (human size) to 0.1 mm (ant size), the gravitational potential energy scales as: (1/10000)4 = 1/10,000,000,000,000,000.
• The potential energy decreases by a factor of ten trillion.
• This is why an ant can walk away from a fall that is 10 times it’s height, and we do not!
ADVANTAGES-MEMS
103
•
Minimize energy and materials use in manufacturing, low cost.•
Redundancy and arrays.•
Integration with electronics.•
Reduction of power budget.•
Faster devices, Increased selectivity and sensitivity.•
Exploitation of new effects through the breakdown of continuum theory in the micro-domain.•
Improved reproducibility (batch fabrication).•
Improved accuracy and reliability.•
Minimally invasive (e.g. pill camera).MEMS - SOME APPLICATIONS
104
MEMS - SOME APPLICATIONS
105
MEMS - SOME APPLICATIONS
106
MEMS - SOME APPLICATIONS
107
• Crash Sensing for Airbag Control
• Vehicle Dynamic Control
• Rollover Detection
• Antitheft Systems
• Electronic Parking
• Brake Systems
• Vehicle Navigation Systems
MEMS - SOME APPLICATIONS
108
Automotive Airbag Accelerometer
The accelerometer structure is a bulk micromachined suspended silicon mass over a fixed metal electrode that provides a capacitive output as a function of acceleration.
• The sensor is created by anodically bonding a micromachined silicon wafer to a glass wafer and etching away the bulk of the silicon, leaving only the suspended silicon mass.
Sensor Electronic Circuit
MEMS - SOME APPLICATIONS
109
MEMS - SOME APPLICATIONS
110
• Electronics occupy the majority of the 3 mm2 chip area.
• 2-axis device
MEMS - SOME APPLICATIONS
111
Virtual Reality (VR) Systems
• A VR systems’ utility is intimately connected to how convincingly it can recreate life.
• Accelerometers and angular rate sensors) are required to achieve credibility.
• Accelerometer data are converted into positional information via double integration.
• Angular rate sensors determine rotational position by integrating the angular rate.
MEMS - SOME APPLICATIONS
112
113
MEMS - SOME APPLICATIONS
BIONIC EYE
114
MEMS – PILL CAMERA
MEMS - SOME APPLICATIONS
115
MEMS - SOME APPLICATIONS
116
MEMS - SOME APPLICATIONS
117
MEMORY MEMS - MILLIPEDES
118
Array of AFM tips write and read bits – Potential for low and adaptive power MILLIPEDES
Highly Parallel, very dense AFM data Storage system – 500 Gb / Sq. inch
NANO-INSTRUMENTATION
119
• Nanotechnology emerges from a broad range of scientific fields that converge due to the continuous miniaturization.
• In 1960’s critical dimensions reached the level of 100 μm.
• 20 years later “micromechanics” reached 1 μm. During this evolution fabrication tools were changed significantly, and models of our understanding developed into finer and finer details.
• But the basic understanding was based on continuum mechanics, where the atomic structure of matter is mostly neglected.
NANO-INSTRUMENTATION
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• When critical dimensions reached the 100 nm level around year 2000, traditional machining became technically problematic.
• The concept of continuum mechanics broke down as the atomic structure of materials becomes directly relevant for the mechanical properties of materials.
• This is the scientific challenge of nanotechnology: the traditional concepts break down, and so do the terminology and parameters that we use to describe the phenomena.
• New concepts and terminology have to be developed, and these are likely to be significantly more complex than we have been used to.
NANO-INSTRUMENTATION
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• Nanotechnology includes the investigation and manufacture of any mechanical, electronic, chemical, and biological system by molecular assembly, the so-called bottom-up approach, as well as the so-called top-down approach by miniaturization of processes and products.
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Examples of critical dimensions are:
• Roughness of a sheet metal for car body production where paintability is the required function.
• The edge in an optical filter for telecommunication, where the edge itself may be several μm.
• Porosity of polymer molecular membranes for advanced drug delivery.
• Distances in molecules, where the function is associated with a particular configuration.
NANO METROLOGY
• INTRFEROMETRY
• SCANNING ELECTRON MICROSCOPE
• ATOMIC FORCE MICROSCOPY
• XRAY ABSORPTION SPECTROMETRY
• ELECTRON SPECTROSCOPY FOR CHEMICAL ANALYSIS
• AUGER
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NANO METROLOGY
Displacement Interferometry
• Displacement Interferometry is based on the light-dark transitions corresponding to constructive and destructive interferences in a classical Michelson interferometer setup.
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DISPLACEMENT
MOVING OPTICAL ELEMENT MEASUREMENT BEAM
MEASUREMENT OPTIC FROM LASER
(1 OR 2 WAVELENGTHS)
RECOMBINED BEAM
FIXED REFERENCE OPTICAL ELEMENT
Displacement d = λ/2(N+∆ /2 )
Resolution – 10nm – 0.1 nm
NANO METROLOGY SCANNING
ELECTRON MICROSCOPE
NANO METROLOGY SCANNING ELECTRON MICROSCOPE
• The SEM uses electrons instead of light to form an image.
• A beam of electrons is produced at the top of the microscope by heating of a metallic filament.
• The electron beam follows a vertical path through the column of the microscope. It makes its way through electromagnetic lenses which focus and direct the beam down towards the sample.
• Once it hits the sample, other electrons
• ( backscattered or secondary ) are ejected from the sample. Detectors collect the secondary or backscattered electrons, and convert them to a signal that is sent to a viewing screen similar to the one in an ordinary television, producing an image.
How do we get an image?
156 electrons!
Image Detector
Electron gun
288 electrons!
Electron beam-sample interactions
The incident electron beam is scattered in the sample, both elastically and inelastically
This gives rise to various signals that we can detect (more on that on next slide)
Interaction volume increases with increasing acceleration voltage and decreases with increasing atomic number
Signals from the sample
Incoming electrons Secondary electrons
Backscattered electrons
Auger electrons
X-rays
Cathodo-
luminescence (light)
Sample
Where does the signals come from?
• Diameter of the interaction
volume is larger than the electron spot
resolution is poorer than the size of the electron spot
Secondary electrons (SE)
Generated from the collision between the incoming electrons and the loosely bonded outer electrons
Low energy electrons (~10-50 eV)
Only SE generated close to surface escape (topographic information is obtained)
Number of SE is greater than the number of incoming electrons
We differentiate between SE1 and
SE2
The secondary electrons that are generated by the incoming electron beam as they enter the surface
High resolution signal with a resolution which is only limited by the electron beam diameter
SE1
Backscattered electrons (BSE)
A fraction of the incident electrons is retarded by the electro-magnetic field of the nucleus and if the scattering angle is greater than 180° the electron can escape from the surface
High energy electrons (elastic scattering)
Fewer BSE than SE
SE2
The secondary electrons that are generated by the backscattered electrons that have returned to the surface after several inelastic
scattering events
SE2 come from a surface area that is bigger than the spot from the
incoming electrons resolution is poorer than for SE1 exclusively
Sample surface
Incoming electrons SE2
ATOMIC FORCE MICROSCOPY
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Photodiode
Laser
Scanner
Cantilever + Sharp probe Photodiode
Laser
Scanner
Cantilever + Sharp probe Photodiode
Laser
Scanner
Cantilever + Sharp probe Photodiode
Laser
Scanner Photodiode
Laser
Scanner Photodiode
Laser
Scanner
Cantilever + Sharp probe Photodiode
Laser
Scanner
Cantilever + Sharp probe Photodiode
Laser
Scanner
Cantilever + Sharp probe Photodiode
Laser
Scanner
Cantilever + Sharp probe Photodiode
Laser
Scanner
Cantilever + Sharp probe Photodiode
Laser
Scanner
Cantilever + Sharp probe Photodiode
Laser
Scanner
Cantilever + Sharp probe
During scanning, the sample surface may
lift the cantilever up, resulting in corresponding move up of the optical reflection spot on the photodiode. However, this single photodiode couldn’t detect small position change of the spot.
(Click for the next)
Let’s split the photodiode into two – the “top” and the “bottom”.
Assume that the optical reflection spot originally locates in the exactly middle of this split photodiode, resulting in the exactly same voltage output from the two photodiodes. So, the difference between the “top” (T) and the “bottom” (B) is zero.
(Click for the next)
Optical level detection
Photodiode
Laser
Scanner
Cantilever + Sharp probe
Voltage Difference Between Top & Bottom Photodiodes
Photodiode
Laser
Scanner
Cantilever + Sharp probe
Top-Bottom Signal (V) or Deflection (nm) or Force (nN)
Quad photodiode to detect Both vertical and horizontal Movements of the light spot.
With this “split photodiode”, any slight vertical movement of the reflection spot position is detected by checking the
difference between the “top” and the “bottom” photodiode dutputs (the “T-B signal”).
• Direct mechanical contact between the probe and the sampler surface
– Essential difference from traditional microscopy
• How AFM “feels” the surface topography?
– Optical level detection
• Constant-height scan versus Constant-force scan
How AFM works
Constant-height scan
Constant-force scan
Optical level detection in constant-force mode
Photodiode
Laser
Z scanner
Cantilever + Sharp probe Photodiode
Laser
Z scanner
Cantilever + Sharp probe Photodiode
Laser
Z scanner
Cantilever + Sharp probe
In constant-force mode, whenever the sample surface topography would result in the cantilever deflection change, the other end of cantilever would be accordingly
adjusted so that the cantilever deflection angle, and hence the contact force, would keep
constant.
Horizontal
Feedback control in constant-force mode
P.I.D. Control
In constant-force mode, the cantilever’s vertical position is adjusted by an
electronic feedback loop, with the T-B signal as the input and the vertical scanner voltage as the output.
Vertical
Constant-force scan vs.
constant-height scan
Constant-force mode Constant-height mode
Constant-force scan vs.
constant-height scan
Constant-force
• Advantages:
– Large vertical range – Constant force (can be
optimized to the minimum)
• Disadvantages:
– Requires feedback control
– Slow response
Constant-height
• Advantages:
– Simple structure (no feedback control) – Fast response
• Disadvantages:
– Limited vertical range (cantilever bending and detector dynamic range) – Varied force
How AFM works
• Direct mechanical contact between the probe and the sampler surface
– Essential difference from traditional microscopy
• How AFM “feels” the surface topography?
– Optical level detection
• Constant-height scan and constant-force scan
• Feedback control in constant-force scan
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